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Power chips are connected to external circuits with packaging, and their efficiency depends upon the support of the packaging. In high-power situations, power chips are generally packaged as power modules. Chip affiliation describes the electrical link on the top surface of the chip, which is generally aluminum bonding wire in traditional components. ^
Typical power module bundle cross-section

Currently, industrial silicon carbide power modules still mainly utilize the packaging innovation of this wire-bonded standard silicon IGBT module. They encounter issues such as large high-frequency parasitic specifications, not enough warm dissipation capacity, low-temperature resistance, and not enough insulation toughness, which restrict the use of silicon carbide semiconductors. The display screen of outstanding performance. In order to resolve these issues and completely exploit the substantial prospective benefits of silicon carbide chips, many new packaging innovations and remedies for silicon carbide power modules have emerged over the last few years.

Silicon carbide power component bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have developed from gold wire bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually developed from gold wires to copper cables, and the driving force is expense decrease; high-power devices have actually created from aluminum wires (strips) to Cu Clips, and the driving force is to enhance product efficiency. The better the power, the greater the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a strong copper bridge soldered to solder to link chips and pins. Compared with traditional bonding product packaging techniques, Cu Clip technology has the following advantages:

1. The link between the chip and the pins is constructed from copper sheets, which, to a specific degree, changes the common cord bonding technique between the chip and the pins. Consequently, a special bundle resistance value, higher present circulation, and far better thermal conductivity can be obtained.

2. The lead pin welding area does not require to be silver-plated, which can completely save the cost of silver plating and inadequate silver plating.

3. The item appearance is completely regular with regular products and is generally made use of in servers, portable computer systems, batteries/drives, graphics cards, motors, power supplies, and other fields.

Cu Clip has two bonding approaches.

All copper sheet bonding technique

Both eviction pad and the Source pad are clip-based. This bonding method is a lot more pricey and intricate, but it can accomplish far better Rdson and much better thermal effects.

( copper strip)

Copper sheet plus cord bonding method

The resource pad makes use of a Clip technique, and eviction utilizes a Wire technique. This bonding approach is a little cheaper than the all-copper bonding method, conserving wafer location (suitable to really small gate locations). The procedure is simpler than the all-copper bonding technique and can obtain much better Rdson and much better thermal effect.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding hard drawn copper, please feel free to contact us and send an inquiry.

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